ICD970

．3rd Gen Intel® Xeon® Processor D-1700 Family ．Default 2 260-pin DDR4 2666 SO-DIMM, dual channel mode up to 64GB ．3rd DIMM by request(SDPC mode by request to support DDR4 2933MHz) ．Support extended operating temperature: -40 to 85°C ．10GBASE-KR: Support up to 4 x 10GbE Mac ports ．Multiple Expansion: 1 PCIe x16 (Gen4), 2 PCIe x8 (Gen3), 1 SMBus, 1 I2C, 1 LPC, 2 UART (TX/RX) ．Rich I/O: 2 Intel GbE, 4 USB 3.0, 4 USB 2.0, 2 SATA 3.0

Motherboards

System On Module

COM Express Basic

ASL9A2

．Intel® Atom® Processor Alder Lake N Series ．Dual Channel LPDDR5 4800MHz up to 16GB ．1 LVDS/eDP, 1 DDI (HDMI/DP++)；Supports dual displays: DDI + LVDS/eDP ．Multiple expansions: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC ．Rich I/O: 2 USB 3.1, 8 USB 2.0 ．High Speed Ethernet: Supports 100M/1000M/2.5Gbps

Motherboards

System On Module

COM Express Mini

Defense Brochure

RPS9HC

．13th Gen Intel® Core™ with Intel® R680E/Q670E/H610E Chipset ．4 DDR5 SODIMM 3600MHz up to 128GB ．Quad Displays: eDP + 3 DDI ．DDI supports up to 8K ．Multiple Expansion: 1 PCIe x16 (Gen5), 4 PCIe x4 (Gen4), 2 PCIe x4 (Gen3), 2 PCIe x1 (Gen3) ．Rich I/O: 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 8 USB 2.0

Motherboards

System On Module

COM HPC

ECX700-AL

．Intel® Atom® Processor E3900 Series Apollo Lake Quad Core CPU ．Intel® Gen9 Graphic Performance ．Extreme Ruggedized design to IEC 60068-2-64 & -40 ~ 70°C wide temperature ．Rich I/O help integrators meet the demand for various applications ．To fulfill wireless transmission, an external SIM slot reduces the difficulties to change SIMs, and the high gain antenna ensures the quality of the signal ．Various applications: Industrial automation, Outdoor application ．Waterproof & Dustproof design conforming to IP67/ IP69K ．Long-term Promise of 15-Year CPU Life Cycle Until Q4' 31 (Based on Intel IOTG Roadmap)

Defense

Waterproof Demonstration

ASL051

· Intel® Atom x7000RE series processors (Code Name : Amston Lake) · 1 DDR5 4800MHz SODIMM · Dual Displays: HDMI + LVDS/eDP (Opt.) · Multiple Expansion: 1 M.2 E Key, 2 M.2 B Key · Rich I/O: 2 Intel 2.5GbE, 2 COM, 2 USB 3.2, 2 USB 2.0

Motherboards

Single Board Computer

3.5" SBC

ASL553

· Intel® Atom® x7000RE Series Processors (Code Name: Amston Lake) · 1 DDR5 SO-DIMM · 4K High Resolution: Supports 4K/2K resolution · Triple Display: 1 HDMI, 1 Type-C DP Alt. Mode, 1 LVDS/eDP (Opt.) · Rich I/O Connectivity: 3 2.5GbE LAN, 4 USB 3.2, 2 USB 2.0, 1 SATA · Support wide temperature from -40 to 85 degree

Motherboards

Single Board Computer

3.5" SBC

Drone (Qualcomm OSM module)

- Qualcomm QRB5165 Processor, 8x Kryo 585 2.84Ghz - 15 TOPS for AI and deep learning workloads - Support 6 4-lanes MIPI-CSI interface (concurrent) - Support long-range WIFI for remote controller - Form factor: OSM 1.1 size: L, 45x45mm - Application: For Automation AMR, Robotic or UAV

Defense

Qisda’s Drone Solution

ECX700-ASL

．Intel Atom X7211RE/X7213RE/X7433RE/X7835RE SoC (Upgradable to Intel Twin Lake) ．Extreme Ruggedized design to IEC 60068-2-64 & -40 ~ 70°C wide temperature ．Rich I/O help integrators meet the demand for various applications ．To fulfill wireless transmission, an external SIM slot reduces the difficulties to change SIMs, and the high gain antenna ensures the quality of the signal ．Various applications: Industrial automation, Outdoor application ．Waterproof & Dustproof design conforming to IP67/ IP69K

System & PPC

Ultra Compact Fanless PC

Waterproof Demonstration

Defense

QRB812

．Intel® Atom® x7000RE/N-Series Processors (Code Name: Amston Lake) ．Dual Channel LPDDR5 4800MHz up to 16GB ．1 LVDS/eDP, 1 DDI (HDMI/DP++)；Supports dual displays: DDI + LVDS/eDP ．Multiple expansions: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC ．Rich I/O: 2 USB 3.1, 8 USB 2.0 ．High Speed Ethernet: Supports 100M/1000M/2.5Gbps

Motherboards

System On Module

OSM

ASL968

．Intel® Atom® x7000RE/N-Series Processors (Code Name: Amston/Twin Lake) ．Single Channel DDR5 4800MHz SODIMM up to 16GB ．Triple Displays: LVDS/eDP + 2 DDI ．Onboard eMMC up to 128GB(opt.) ．Multiple Expansion: Up to 7 PCIe x1, 1x I2C, 1 SMBus ．Rich I/O: 1 Intel 2.5GbE, up to 4 USB 3.2, 2 SATA 3.0

Motherboards

System On Module

COMe Type6

MTH968

． Intel® Core™ Ultra Processor (Meteor/Arrow Lake: U/H-series) ．Dual Channel DDR5 5600MHz SODIMM up to 64GB ．Multiple Displays: 1 VGA + 1 LVDS/eDP + 3 DDI ．Supports 4K / 2K resolution ．Multiple Expansion: 2 PCIe x4, 5 PCIe x1, 1 PCIe x8, 1 I2C, 1 SMBus ．Rich I/O: 1 Intel 2.5GbE, 2 USB 4.0, 4 USB 3.2, 8 USB 2.0, 2 SATA 3.0

Motherboards

System On Module

COM Express Compact